Cu ajutorul acestui aparat este posibila masurarea automata a grosimii stratului de acoperire si analiza materialului sculelor aschietoare.
Domeniile tipice de folosire sunt:
- Analizarea straturilor subtiri si foarte subtiri, de ex. straturi de aur si paladiu de ≤0,1 µm
- Masurarea straturilor functionale in industria electronicii si a semi-conductoarelor
- Determinarea sistemelor complexe multistrat
- Masurari automatizate de ex. in controlul calitatii
- Determinarea continutului unui element din stratul de acoperire;
With this device it is possible to automatically measure the coating thickness and material analysis of cutting tools.
Typical areas of use are:
- Analysis of thin and very thin, for example layers of gold and palladium ≤ 0.1 µm
- Measuring of the functional layers in the electronics industry and semi-conductors
- Determination of complex multilayer systems
- Automated measurements. For example quality control
- Determination of the content from the coating layers